Configurable cold-plates of datacenter cooling systems

ABSTRACT

A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.17/004,963, filed on Aug. 27, 2020, entitled “CONFIGURABLE COLD-PLATESOF DATACENTER COOLING SYSTEMS” the contents of which are herebyincorporated by reference herein in its entirety for all intents andpurposes.

FIELD

At least one embodiment pertains to a cold plate that is configurationand for a datacenter liquid cooling system. In at least one embodiment,the cold plate has a first section, a second section, and anintermediate layer, which is changeable and has first channels to enableflow of a coolant and has second channels or at least one adapted secondchannel to concentrate the coolant or the flow of the coolant to atleast one area within the cold plate.

BACKGROUND

Datacenter cooling systems typically use fans to circulate air throughserver components. Certain supercomputers or other high capacitycomputers may use water or other cooling systems than air coolingsystems to draw heat away from the server components or racks of thedatacenter to an area external to the datacenter. The cooling systemsmay include a chiller within the datacenter area, including the areaexternal to the datacenter. The area external to the datacenter may bean area including a cooling tower or other external heat exchanger thatreceives heated coolant from the datacenter and disperses the heat byforced air or other means to the environment (or an external coolingmedium) before the cooled coolant is recirculated back into thedatacenter. In an example, the chiller and the cooling tower togetherform a chilling facility with pumps responsive to temperature measuredby external devices applied to the datacenter. Air cooling systems alonemay not draw sufficient heat to support effective or efficient coolingin datacenters and liquid cooling systems may not distribute coolanteffectively or efficiently.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments in accordance with the present disclosure will bedescribed with reference to the drawings, in which:

FIG. 1 is a block diagram of an example datacenter having a coolingsystem subject to improvements described in at least one embodiment;

FIG. 2A is a block diagram illustrating server-level features associatedwith a configurable cold plate for a datacenter liquid cooling system,according to at least one embodiment;

FIG. 2B is a block diagram illustrating component-level featuresassociated with a configurable cold plate for a datacenter liquidcooling system, according to at least one embodiment;

FIG. 3A is a diagram illustrating perspective views of a first sectionand a second section of a configurable cold plate for a datacenterliquid cooling system, according to at least one embodiment;

FIG. 3B is a diagram illustrating a plan view of an intermediate layerfor a configurable cold plate for a datacenter liquid cooling system,according to at least one embodiment;

FIG. 3C are diagrams illustrating various cross-section views showingsecond channels or an adapted second channel in an intermediate layerfor a configurable cold plate for a datacenter liquid cooling system,according to at least one embodiment;

FIG. 3D are diagrams illustrating a plan view of a first section and anassociated intermediate layer for a configurable cold plate for adatacenter liquid cooling system, according to at least one embodiment;

FIG. 3E are diagrams illustrating a plan view of another first sectionand anther associated intermediate layer for a configurable cold platefor a datacenter liquid cooling system, according to at least oneembodiment;

FIG. 4 is a block diagram illustrating rack-level features associatedwith a configurable cold plate for a datacenter liquid cooling system,according to at least one embodiment;

FIG. 5A is a process flow of steps available for a method of using theconfigurable cold plate of FIGS. 2A-4, according to at least oneembodiment;

FIG. 5B is a process flow of steps available for a method ofmanufacturing the configurable cold plate of FIGS. 2A-4, according to atleast one embodiment; and

FIG. 6 illustrates an example datacenter, in which at least oneembodiment from FIGS. 2A-5B may be used.

DETAILED DESCRIPTION

Air cooling of high density servers may not be efficient or may beineffective in view of sudden high heat requirements caused by changingcomputing-loads in present day computing components. However, as therequirements are subject to change or tend to range from a minimum to amaximum of different cooling requirements, these requirements must bemet in an economical manner, using an appropriate cooling system. Formoderate to high cooling requirements, liquid cooling system may beused. The different cooling requirements also reflect different heatfeatures of the datacenter. In at least one embodiment, heat generatedfrom the components, servers, and racks are cumulatively referred to asa heat feature or a cooling requirement as the cooling requirement mustaddress the heat feature entirely. In at least one embodiment, the heatfeature or the cooling requirement for a cooling system is the heatgenerated or the cooling requirement of the components, servers, orracks associated with the cooling system and may be of a portion ofcomponents, servers, and racks in the datacenter.

In at least one embodiment, a cold plate that is configurable and for adatacenter liquid cooling system is disclosed. The cold plate addressesdesign lag in liquid-cooled cold plates which may be standardized andmay not be constructed to efficiently and effectively remove sufficientheat from an associated computing or datacenter device, such as agraphics processing unit (GPU), a switch, a dual inline memory module(DIMM), or a central processing unit (CPU). Furthermore, an associatedcomputing or datacenter device may be a processing card having one ormore GPUs, switches, or CPUs thereon. Each of the GPUs, switches, andCPUs may be a heat generating feature of the computing device. In atleast one embodiment, the GPU, CPU, or switch may have one or morecores, and each core may be a heat generating feature. The ability toremove heat by the cold plate may be improved by the present disclosure,where, in at least one embodiment, the channels (or micro-channels) areprovided in an intermediate layer between a first section and a secondsection of a cold plate to concentrate a coolant or a flow of thecoolant through the cold plate. In at least one embodiment, toconcentrate a coolant or a flow of the coolant through the cold platemay be to increase surface area for concentrated heat or thermaltransfer from a material of the intermediate layer (and consequently tothe cold plate) to the coolant.

In at least one embodiment, a cold plate that is configurable and is fora datacenter liquid cooling system includes a first section, a secondsection, and the intermediate layer. The intermediate layer ischangeable with other intermediate layers and is removably locatedwithin the first section and the second section that may be thenhermetically sealed together using provided clips, in at least oneembodiment. Each of the intermediate layers has first channels to enableflow of a coolant through the intermediate layer and has second channelsor at least one adapted second channel to concentrate the coolant or theflow of the coolant to at least one area within the cold plate. In atleast one embodiment, the at least one adapted second channel isdifferently dimensioned or patterned to distinguish from an individualfirst channel of the first channels. The different dimension or patternenables the at least one adapted second channel to expose more surfacearea to a coolant within the at least one adapted second channel thanthe individual first channel.

In at least one embodiment, the adaptation for the at least one adaptedsecond channel is waves structures or dimples throughout the at leastone adapted second channel even though the at least one adapted secondchannel has similar dimensions to the individual first channel. The wavestructures or dimples enable more surface area of the material of theintermediate layer to contact the coolant and transfer heat to thecoolant than a plain or flat surface as in the case of the individualfirst channel. In at least one embodiment, the adaptations are materialadaptations where the material in the at least one adapted secondchannel is different than a material of the first channel, and enablesmore heat transfer to the coolant than the individual first channel.

In at least one embodiment, the second channels or the at least oneadapted second channel is located in the intermediate layer tocorrespond to at least a heat generating feature of an associatedcomputing device. As such, it is possible in at least one embodiment, todetermine cooling requirements of an associated computing device basedin part on a location of a heat generating feature, such as a CPU, GPU,or a switch; and to then machine or select an intermediate layer havingthe second channels or the at least one adapted second channel in anarea corresponding to the heat generating feature when the intermediatelayer is hermetically sealed in the cold plate.

In at least one embodiment, the channels may be differently sized by atleast a different dimension to its cross-section. In at least oneembodiment, the channel is enabled by slots. In at least one embodiment,a first channel guides the coolant, while one or more of the secondchannels is adapted to have at least one different dimension than thefirst channel, where the different dimension ensures that coolantthrough the second channel is more or at faster flow rate than in thefirst channel. In at least one embodiment, the at least one differentdimension also enables more surface area within the second channel toexchange more heat to the coolant from a material of the cold plate inthe second channel relative to the first channel. In at least oneembodiment, the slots enable a faster flow rate at least by a reducedcross-section to force coolant at a higher flow rate from one firstchannel to another first channel so that incoming coolant flows throughthe first channel at a first flow rate, the second channel at a secondflow rate, and out the cold plate at the second flow rate or a slowerflow rate. In at least one embodiment, the reduced cross-section alsoenables more material forming surface areas to interface more with thecoolant and consequently transfer more heat to the coolant.

In at least one embodiment, the dimensioning of the channel or theprovisioning of slots to function as the channels increases a heattransfer surface area within the cavity of the cold plate. The may bethe case for a provided fluid (such as a coolant) inlet temperature andits flow rate. Therefore, in at least one embodiment, the secondchannels, by the dimensioning or slots, enable concentration of thecoolant in areas having more heat transfer surface area within the coldplate. In at least one embodiment, the concentration of the coolant isin reference to concentration of heat or thermal transfer surface areawithin second channels that is more than the first channels. Thisapplication presents a unique method of increasing the heat removalability of a cold plate by changing the micro-channel design andplacement in a universal cold plate design.

In at least one embodiment, each cold plate is composed of the firstsection which may be an upper section having inlets and outlets forfluid (such as a coolant) of a secondary cooling loop. Each cold plateis composed of the second sections that may be a lower section to fithermetically with the first section. In at least one embodiment,provision is made in one or more of the first section and the secondsection for gaskets to enable the hermetic seal. Fluid-flow channels ormicro-channels are provided in different configurations or adaptationsof intermediate layers to concentrate the flow of coolant or the coolantin different areas of the intermediate layer, which translates todifferent areas of the cold plate when the intermediate layer is fixedin the lower section and the upper section is sealed to the lowersection. In at least one embodiment, the seal is hermetic, but is alsoremovable to enable replacement of the intermediate layer. In at leastone embodiment, the intermediate layer is composed of multiple parts,where the first channels form one part that may be removably insertedinto the lower portion first, while the second channels or the adaptedsecond channel is a second part to be inserted, removably, into thelower portion in a second step.

In at least one embodiment, a selection of a micro-channels or channelsinside the cavity of one or more of the two parts is made from uniquelydesigned parts already available for use with a variety of differentcomputing devices. In at least one embodiment, the micro-channels orchannels are machined specifically for a computing device. In at leastone embodiment, the machining includes drilling, forming, computer-aidedmachining, growing or printing. The unique designs of the intermediatelayer or parts thereof for the cold plate enable removing of desiredamounts of heat with provisions for a resulting pressure drop to beachieved in the coolant flow that is an acceptable pressure drop toaddress cooling requirements of the computing devices. The selection ormachining of the micro-channels or channels may, in at least oneembodiment, include selection of materials, surface finish, and anglesof the surface or cross-section (such as straight, waviness,width/height) of the channels to create desired flow characterizationfor any amount of inlet flow, for different inlet fluid temperature,fluid chemistry, and rated pressure drops.

FIG. 1 is a block diagram of an example datacenter 100 having a coolingsystem subject to improvements described in at least one embodiment. Thedatacenter 100 may be one or more rooms 102 having racks 110 andauxiliary equipment to house one or more servers on one or more servertrays. The datacenter 100 is supported by a cooling tower 104 locatedexternal to the datacenter 100. The cooling tower 104 dissipates heatfrom within the datacenter 100 by acting on a primary cooling loop 106.Further, a cooling distribution unit (CDU) 112 is used between theprimary cooling loop 106 and a second or secondary cooling loop 108 toenable extraction of the heat from the second or secondary cooling loop108 to the primary cooling loop 106. The secondary cooling loop 108 canaccess various plumbing all the way into the server tray as required, inan aspect. The loops 106, 108 are illustrated as line drawings, but aperson of ordinary skill would recognize that one or more plumbingfeatures may be used. In an instance, flexible polyvinyl chloride (PVC)pipes may be used along with associated plumbing to move the fluid alongin each of the loops 106, 108. One or more coolant pumps, in at leastone embodiment, may be used to maintain pressure differences within theloops 106, 108 to enable the movement of the coolant according totemperature sensors in various locations, including in the room, in oneor more racks 110, and/or in server boxes or server trays within theracks 110.

In at least one embodiment, the coolant in the primary cooling loop 106and in the secondary cooling loop 108 may be at least water and anadditive, for instance, glycol or propylene glycol. In operation, eachof the primary and the secondary cooling loops has their own coolant. Inan aspect, the coolant in the secondary cooling loops may be proprietaryto requirements of the components in the server tray or racks 110. TheCDU 112 is capable of sophisticated control of the coolants,independently or concurrently, in the loops 106, 108. For instance, theCDU may be adapted to control the flow rate so that the coolant(s) isappropriately distributed to extract heat generated within the racks110. Further, more flexible tubing 114 is provided from the secondarycooling loop 108 to enter each server tray and to provide coolant to theelectrical and/or computing components. In the present disclosure, theelectrical and/or computing components are used interchangeably to referto the heat-generating components that benefit from the presentdatacenter cooling system. The tubing 118 that form part of thesecondary cooling loop 108 may be referred to as room manifolds.Separately, the tubing 116 extending from tubing 118 may also be part ofthe secondary cooling loop 108 but may be referred to as row manifolds.The tubing 114 enters the racks as part of the secondary cooling loop108 but may be referred to as rack cooling manifold. Further, the rowmanifolds 116 extend to all racks along a row in the datacenter 100. Theplumbing of the secondary cooling loop 108, including the manifolds 118,116, and 114 may be improved by at least one embodiment of the presentdisclosure. An optional chiller 120 may be provided in the primarycooling loop within datacenter 102 to support cooling before the coolingtower. To the extent additional loops exist in the primary control loop,a person of ordinary skill would recognize reading the presentdisclosure that the additional loops provide cooling external to therack and external to the secondary cooling loop; and may be takentogether with the primary cooling loop for this disclosure.

In at least one embodiment, in operation, heat generated within servertrays of the racks 110 may be transferred to a coolant exiting the racks110 via flexible tubing of the row manifold 114 of the second coolingloop 108. Pertinently, second coolant (in the secondary cooling loop108) from the CDU 112, for cooling the racks 110, moves towards theracks 110. The second coolant from the CDU 112 passes from on one sideof the room manifold having tubing 118, to one side of the rack 110 viarow manifold 116, and through one side of the server tray via tubing114. Spent second coolant (or exiting second coolant carrying the heatfrom the computing components) exits out of another side of the servertray (such as enter left side of the rack and exits right side of therack for the server tray after looping through the server tray orthrough components on the server tray). The spent second coolant thatexits the server tray or the rack 110 comes out of different side (suchas exiting side) of tubing 114 and moves to a parallel, but also exitingside of the row manifold 116. From the row manifold 116, the spentsecond coolant moves in a parallel portion of the room manifold 118going in the opposite direction than the incoming second coolant (whichmay also be the renewed second coolant), and towards the CDU 112.

In at least one embodiment, the spent second coolant exchanges its heatwith a primary coolant in the primary cooling loop 106 via the CDU 112.The spent second coolant is renewed (such as relatively cooled whencompared to the temperature at the spent second coolant stage) and readyto be cycled back to through the second cooling loop 108 to thecomputing components. Various flow and temperature control features inthe CDU 112 enable control of the heat exchanged from the spent secondcoolant or the flow of the second coolant in and out of the CDU 112. CDU112 is also able to control a flow of the primary coolant in primarycooling loop 106.

In at least one embodiment, the cold plates herein support changes inpower and thermal characteristics of various computing component withouta need for a new cold plate and merely by replacing the intermediatelayer. In at least one embodiment, therefore, the cold plates hereinenable a universal cold plate with an ability to follow changes tocomputing components, but also to allow replacing of internal heattransfer assembly or chemistry of a fluid that may otherwise affect theperformance of a cold plate if not for different channel sizing that maycompensate for these changes. In addition, the ability to change theintermediate layer enables design teams to quickly and seamlessly designand deploy liquid cooling components for servers in datacenterapplications. The cold plates herein also enable use of a universalclass of liquid cooling by at least replacing thermal characteristics ofthe cold plate, such as the micro-channels, which translate to amodification of the cold plate design to meet and exceed the datacenterneeds.

FIG. 2A is a block diagram 200 illustrating server-level featuresassociated with a configurable cold plate for a datacenter liquidcooling system, according to at least one embodiment. The server-levelfeatures include a server tray or box 202 having at least one servermanifold 204 to allow entry and egress of cooling fluid such as acoolant from a rack to the server tray or box 202. Coolant from a rackmanifold enters via inlet pipe 206 and exists via outlet pipe 208. Thecoolant, on the server side travels via inlet line 210, through one ormore cold plates 210A, 210B, and via outlet line 212 to the manifold204. This represents at least one or multiple cooling loops 214A, 214Bwithin the server tray or box 202. In at least one embodiment, the coldplates 210A-D are associated with at least one computing component220A-D.

In at least one embodiment, one or more of the cold plates 210A-D areconfigurable cold plates. In at least one embodiment, even thoughillustrated as having one inlet and one outlet for inlet line 210 andfor outlet line 212, there may be multiple intermediate lines, such asflexible pipes associating the cold plate with the respective inlet line210 and outlet line 212. In at least one embodiment, the intermediatelines directly couple the cold plate to the manifold 204 are providedinlet and outlets for such connections. In at least one embodiment,fluid adapters are provided to enable such coupling. In at least oneembodiment, the fluid adapters are sized to the inlet and outletprovisions in the cold plate and the manifold 204.

FIG. 2B is a block diagram 250 illustrating component-level featuresassociated with a configurable cold plate for a datacenter liquidcooling system, according to at least one embodiment. Thecomponent-level features include a computing or datacenter device formedof one or more of components 252, 254. In at least one embodiment,component 252 is a board or card, such as a printed circuit board (PCB)or printed circuit card that in enveloped and shielded to protectcomponents therein. In at least one embodiment, component 254 is a chipor semiconductor device, such as a CPU, a GPU, or a switch. In at leastone embodiment, even though only one component 254 is illustrated, thePCB 252 may have multiple components mounted thereon. In at least oneembodiment, the component 254 may include multiple die (such as amulti-core processor device). In at least one embodiment, the cores maybe stacked or distributed. In at least one embodiment, the components252; 254 may have different heat generating features represented by atleast locations of the die therein. In the case of the PCF 252, whenthere are multiple components 254 thereon, each component may be a heatgenerating feature.

In at least one embodiment, a cold plate 258 is associated with thecomputer device. In the illustration of FIG. 2B, the cold plate 258 isassociate with the computing device 254. In at least one embodiment, thecold plate 258 may extend throughout the dimensions of the PCB 252 toprovide direct or indirect contact cooling to one or more computingcomponents on the PCB 252. In at least one embodiment, when a graphicsprocessing card is the computing device, the cold plate 258 extends overthe entire card, but the channels therein may enable concentration ofcoolant or the flow of coolant over areas of the card having processoror memory-intensive computing devices. The computing device maytherefore have further computing devices associated therewith.

In at least one embodiment, the cold plate 258 is associated with thecomputing device 254 via a thermal transfer layer 256. The thermaltransfer layer may be a layer having one or more of silicon, a thermalinterface material, or air. In at least one embodiment, there may be nothermal transfer layer 256 and a bottom section 258A may be directlyassociated with the computing device 254. The cold plate has a topsection 258B with at least one inlet for coolant inlet line 260 and atleast one outlet for coolant outlet line 262. In at least oneembodiment, the top section 258B is hermetically seal with the bottomsection 258A using gaskets in between and at least a latch clip 264,although multiple latch clips may be provided throughout the sides ofthe top and the bottom sections to latch the sections together. In atleast one embodiment, there may be a hinge on at least one side to keepthe sections together during changing of an intermediate layer therein.

FIG. 3A is a diagram illustrating perspective views 300 of a firstsection 302 and a second section 308 of a configurable cold plate for adatacenter liquid cooling system, according to at least one embodiment.The first section 302 and the second section 308 may be associated withone or more intermediate layers, such as an intermediate layerillustrated in FIG. 3B. In at least one embodiment, one or more gasketsare associated with at least the first section or the second section toenable a hermetic seal once the first section and the second section isclosed together. In at least one embodiment, latch chips formed of twosides, a latch receiver 310A and a latch 310B enable the hermetic sealby holding the sections together.

In at least one embodiment, fluid adapters 304, 306 extend from theconfigurable cold plate to enable receipt and egress of the coolantbetween the cold plate and at least a cooling manifold, such as theserver manifold illustrated in FIG. 2A. In at least one embodiment, thebottom section 308 enables a perfect fit for the intermediate layer thatsits flush within the bottom section 308. Moreover, in at least oneembodiment, there is minimum room for any fluid to flow between thebottom section 308 and the intermediate layer. Indeed, the intermediatelayer, in at least one embodiment, may have one or more orifices (suchas marked sections 324, 328 in FIG. 3B) within the layer to support thefluid adapters 304, 306, or to enable smooth flow (such as any flow lessthan a turbulent flow) of a coolant from the server manifold into theintermediate layer without spillage into any gap between the bottomsection 208 and the intermediate layer. In at least one embodiment,coolant or other fluid flows into inlet fluid adapter 306 and out of theoutlet fluid adapter 304. In at least one embodiment, even if there areno orifices in the intermediate layer, the fluid or coolant is stillenabled to flow as directed by first channels and second channels of theintermediate layer.

FIG. 3B is a diagram illustrating a plan view 320 of an intermediatelayer 322 for a configurable cold plate for a datacenter liquid coolingsystem, according to at least one embodiment. In at least oneembodiment, the intermediate layer 322 is changeable with otherintermediate layers, such as the intermediate layers illustrated inFIGS. 3D and 3E. The intermediate layer 322 includes first channels 326to enable flow of a coolant through the intermediate layer 322 andincludes second channels (or at least one adapted second channel) 330 toconcentrate the coolant or the flow of the coolant to at least one areawithin the intermediate layer 322. In at least one embodiment, when theintermediate layer is in the cold plate, the concentration of thecoolant or the flow of the coolant is to at least one area of the coldplate that coincides with the at least one area of the intermediatelayer 322.

In at least one embodiment, there may be a second channel 330 that isdifferently dimensioned from the first channels 326. The differentdimension of the second channel 330 may be to concentrate the coolant orthe flow of the coolant to at least one area within the intermediatelayer 322. In at least one embodiment, to concentrate the coolant or theflow of the coolant to at least one area within the intermediate layermay be described by an amount of cooling provided in the at least onearea relative to other areas of the intermediate layer (and consequentlyof the cold plate when the intermediate layer is within the cold plate).In at least one embodiment, to concentrate the coolant or the flow ofthe coolant to at least one area within the intermediate layer may bedescribed by the amount of surface area (also referred to as heat orthermal transfer surface area) within the at least one area that isexposed to coolant than in other areas of the intermediate layer (andconsequently of the cold plate when the intermediate layer is within thecold plate). In at least one embodiment, to concentrate the coolant orthe flow of the coolant in the at least one area may be described by anincrease to the concentration of the coolant or an increase in the flowof the coolant in the at least one area relative to other areas of theintermediate layer (and consequently of the cold plate when theintermediate layer is within the cold plate).

In at least one embodiment, the second channel has slots in theintermediate layer. An individual slot of the slots has at least onefirst dimension that is different relative to an individual firstchannel in the first channels and across their respectivecross-sections. In at least one embodiment, the individual slot has adiameter, width, height, or angle that is lesser than that of theindividual first channel. In at least one embodiment, this enablesmultiple slots in the area of the second channel. The multiple slotshave walls forming sides surface areas therein. The side surface areasare plainly referred to as surface areas or as thermal transfer or heattransfer surface areas because they enable more heat transfer to acoolant passing through. The surface areas may also be at the top andbottom of the slots. In at least one embodiment, a second intermediatelayer is available for each cold plate. The second intermediate layer isto be used in the alternative of the intermediate layer. Individualsecond slots of the second intermediate layer may have at least onesecond dimension that is different relative to the at least one firstdimension. The at least one second dimension is different to concentratemore or less of the coolant or the flow of the coolant to the at leastone area or to a different area within the cold plate relative to thefirst intermediate layer.

In at least one embodiment, the flow of the coolant refers to flow rateor flow volume of the coolant in the at least one area relative to theother areas of the intermediate layer. In at least one embodiment, thecoolant is in a dynamic state and is continuously moving through thecold plate. However, as illustrated in at least one embodiment, thefirst channels 326 may be narrower than the second channel 330. As such,the coolant spends more time in the second channel 330 than in the firstchannels 326. In at least one embodiment, to concentrate the coolant orthe flow of the coolant may be to slow a flow rate of the coolant sothat the coolant spends more time exchanging heat from an associatedcomputing device in the at least one area having the second channels. Inat least one embodiment, to concentrate the coolant or the flow of thecoolant may be to increase the flow rate of the coolant so that thecoolant does not saturate with exchanged heat from an associatedcomputing device in the at least one area having the second channels. Asthe coolant is flowing faster, it may cool the at least one area fasteror enable faster heat exchange. In at least one embodiment, even thoughthe second channels 330 may be broader than the first channels 326, thesecond channels 330 be represented by slots that cause a pressuregradient between the first channels 326, so that a higher flow rate isexperienced in the at least one area having the second channels 330.

In at least one embodiment, the at least one adapted second channel isdescribed by having one different dimension than the first channel. Thesecond channel or the at least one adapted second channel is in theintermediate layer to correspond to at least a heat generating featureof an associated computing device. In doing so, in at least oneembodiment, the cold plate is configurable to maximize heat exchangefrom the heat generating feature of the associated computing device.This represents at least an effective and efficient heat exchangeprocess than using a static cold plate that evenly distributes coolant.In at least one embodiment, one or more orifices (such as markedsections 324, 328 in FIG. 3B) within the intermediate layer 322 supportthe fluid adapters 304, 306, or enable smooth flow (such as any flowless than a turbulent flow) of a coolant from the server manifold intothe intermediate layer 322 without spillage into any gap between abottom section and the intermediate layer 322 when the intermediatelayer 322 is removably located within the bottom section.

In at least one embodiment, a seal such as a rubber, silicone, orinactive material is provided around the orifices to adequately preventflow of coolant outside the intermediate layer. In at least oneembodiment, the fluid adapters extend under the top section of the coldplate into the orifices and are held snuggly by the seals. To change theintermediate layer, with the top section of the cold plate open, theintermediate layer may be pulled out and the seal may come out with theintermediate layer. In at least one embodiment, to ensure integrity, newseals may be required for each new or different intermediate layer used.In at least one embodiment, a similar seal is provided for fluidadapters 304, 306 to enable coupling to the coolant lines from theserver manifold or a related cooling loop.

FIG. 3C are diagrams illustrating various cross-section views 340A, B, Cshowing second channels 342A, B; 344A, B; and 346A, B (or an adaptedsecond channel) in an intermediate layer for a configurable cold platefor a datacenter liquid cooling system, according to at least oneembodiment. In at least one embodiment, the intermediate layer 322 is asandwich structure having a top plate 348B and a bottom plate 348A thatare separated by walls (such as the vertical, angled, or circumferentialstructures forming the channels). The walls may hold up the top plates.In at least one embodiment, there is only a bottom plate and the wallsabutting from the bottom plate provide a channel that may be open on topor that may be closed by a top section of the cold plate when theintermediate layer is located within the cold plate. The top section ofthe cold plate then functions as a closure to the walls.

In at least one embodiment, a middle channel 332; 350 is either closedor formed as an additional first channel, along with the first channels326 on either side of the intermediate layer 322. In at least oneembodiment, when the middle channel 332; 350 is closed, it is formed asa through-hole from plan to bottom view of the intermediate layer 322and blocked off by walls so that the coolant does not flow through thisarea. In at least one embodiment, the middle channel 332; 350 is atleast one second channel that may be differently dimensioned so as toconcentrate a second amount of coolant or a second flow of coolantthrough the middle channel 332 relative to a first concentration ofcoolant or first flow of coolant to the first channels 326 and thesecond channels 330.

In at least one embodiment, the cross-section views 340A, B, or C may befound across any one of the embodiment intermediate layers of FIGS. 3B,3D, and 3E. In at least one embodiment, walls forming the secondchannels 342A, B in the cross-section view 340A are vertical (orperpendicular with respect the top section and the bottom sections ofthe cold plate). In at least one embodiment, walls forming the secondchannels 346A, B in cross-section view 340C are angled (with respectiveto the top section and/or the bottom section of the cold plate). In atleast one embodiment, the sandwich structure of plates 348A, B isinitially a machined unibody structure, but the channels 344A, B areformed by holes drilled through the middle of the unibody structurealong its length or width. In at least one embodiment, the channels maybe round and have a diameter as its dimension for reference.

In at least one embodiment, the walls form slots therebetween and theslots traverse a length of the second channels or of the at least oneadapted second channel. Furthermore, the slots, representing the secondchannel, concentrate the coolant or the flow of the coolant to the atleast one area by at least enabling parallel flows through the slots.The walls represent additional surface area forming as interface toexchange heat between an underlying computing device and the coolant. Inat least one embodiment, the middle channel 350 is available in each ofthe embodiments of FIG. 3C. In at least one embodiment, a mix of walls(vertical, angled, or circumferential) may be used in different channelswithin a singular intermediate layer.

FIG. 3D are diagrams illustrating a plan view 360 of a first section 362and an associated intermediate layer 368 for a configurable cold platefor a datacenter liquid cooling system, according to at least oneembodiment. The plan view 360 illustrates that, different from theembodiment in FIGS. 3A and 3B, there may be two inlet fluid adapters364A, B that support two inlets 372A, B for coolant to the intermediatelayer 368 and there may be two outlet fluid adapters 366A, B to supporttwo outlets 374A, B for the coolant. As described with respect to FIGS.3A-C, there may be associated seals with orifices into the sandwichstructure of the intermediate layer 368. Alternatively, the coolantflows from the fluid adapter into the intermediate layer and through thechannels before flowing out. In at least one embodiment, the manysurface areas enabled by the slots described in FIG. 3C is sufficient toconcentrate the coolant or the flow of the coolant in the areas havingthe slots in the intermediate layer (and consequently of the coldplate).

In at least one embodiment, coolant enters the intermediate layer 368from the inlet fluid adapters 364A, B of the top section 362. Thecoolant flows, as indicated by the arrows, thorough one or more firstchannels 370, through one or more second channels 376, out of theoutlets 374A, B provided in the intermediate layer 368, and finally,through either of the outlet fluid adapters 366A, B. In at least oneembodiment, any of the cross-sections discussed with respect to FIG. 3Cmay be applicable to a cross-section of the intermediate layer 368.

FIG. 3E are diagrams illustrating a plan view 380 of another firstsection 382 and anther associated intermediate layer 388 for aconfigurable cold plate for a datacenter liquid cooling system,according to at least one embodiment. The plan view 380 illustratesthat, different from the embodiment in FIGS. 3A, 3B, and 3D, there maybe only one inlet fluid adapters 384 that support one inlet 392 forcoolant to the intermediate layer 368, and there may be multiple outletfluid adapters 386A, B to support two outlets 394A, B for the coolant.These features may enable a higher flow rate due to pressure differencefrom higher outlet pressures enabled by multiple outlet and lower inletpressures from a singular inlet. In at least one embodiment, knowledgeof the fluid dynamics may be provided for selection of the appropriateintermediate layer. In at least one embodiment, when an existing coolingloop is experiencing low coolant pressure (such as towards an end of theline, a last rack, of the coolant plumbing), a single inlet intermediatelayer may enable increase flow rate for the coolant.

In at least one embodiment, as described with respect to FIGS. 3A-C,there may be associated seals with orifices into the sandwich structureof the intermediate layer 388 for the inlet and the outlets of theintermediate layer. Alternatively, the coolant flows from the fluidadapter 384 into the intermediate layer and through the channels beforeflowing out. In at least one embodiment, the many surface areas enabledby the walls forming the slots described in FIG. 3C is sufficient toconcentrate the coolant or the flow of the coolant in the areas havingthe slots in the intermediate layer (and consequently of the coldplate). In at least one embodiment, coolant enters the intermediatelayer 388 from the inlet fluid adapter 384 of the top section 382. Thecoolant flows, as indicated by the arrows, thorough one or more firstchannels, through one or more second channels, out of the outlets 394A,B provided in the intermediate layer 388, and finally, through either ofthe outlet fluid adapters 394A, B. In at least one embodiment, any ofthe cross-sections discussed with respect to FIG. 3C may be applicableto a cross-section of the intermediate layer 388.

FIG. 4 is a block diagram illustrating rack-level features 400associated with a configurable cold plate for a datacenter liquidcooling system, according to at least one embodiment. A rack 402 hasbrackets 404, 406, to enable hanging of one or more cooling loopcomponents within the rack 402. In at least one embodiment, rackmanifolds 412, 414 may be provided to guide coolant from row manifoldsto the server trays or boxes 408 with the rack 402. The rack manifolds412 may pass coolant from the row manifolds through conduit 410, throughthe server trays or boxes 408, out of the egress row manifold 414, andback into the row manifold via the egress conduit 412. The configurablecold plates may use higher pressure intermediate layers towards thebottom server tray or box of the illustrated server trays or boxes 408,if there is a need to increase pressure of coolant flow at that level.Alternatively, as coolant head pressure is higher at the bottom, thehigher-pressure intermediate layers may be used in cold plates of thetop server tray or boxes of the illustrated rack 402.

FIG. 5A is a process flow of steps available for a method 500 of usingthe configurable cold plate of FIGS. 2A-4, according to at least oneembodiment. Step 502 determines at least one computing component havinga heat generating feature, such as a processor core or a processor, aswitch, or a memory component. In at least one embodiment, a sub-step ofstep 502 requires determining an area of the cold plate that isassociated with the heat generating feature. In at least one embodiment,the area is also a reference to a location in the at least one computingdevice where heat generation is maximum during normal usage of the atleast one computing device. In at least one embodiment, a location wherethe heat generation is maximum during saturated use of the at least onecomputing device is used as a basis to perform the subsequent steps forselecting or providing an intermediate layer.

Step 504 provides a cold plate having a first section and having asecond section to be hermetically and removably sealed together. Step506 enables one or more intermediate layers to be changeable in the coldplate and to concentrate a coolant or a flow of the coolant to an areaof the cold plate. In at least one embodiment, step 506 includes asub-step of determining that a first individual intermediate layer hassecond channels or at least one adapted second channel to concentratethe coolant or the flow of the coolant to a first area within the coldplate; and determining that a second individual intermediate layer hasdifferent second channels or at least one adapted and different secondchannel than the first individual intermediate layer to concentrate thecoolant or the flow of the coolant to a second area within the coldplate. In at least one embodiment, step 506 includes a sub-step ofmaking the intermediate layer to the requirements of the at least onecomputing component, as discussed with respect to method 550.

Step 508 determines whether an intermediate layer from step 506 isenabled for the at least one computing device at least the first areacorrespond to the location of the heat generating feature. When this isthe case, step 508 enables the first channels of the first individualintermediate layer to allow flow of the coolant therein and enablessecond channels or at least one adapted second channel to concentratethe flow or the coolant therein. In at least one embodiment, the secondindividual intermediate layer may be determined as appropriate for theat least one computing device and used instead of the first individualintermediate layer.

Method 500 therefore enables one or more intermediate layers to beremovably located within the first section and the second section.Method 500 enables a first individual intermediate layer of the one ormore intermediate layers to be changeable with a second individualintermediate layer. Method 500 ensures that the one or moreinterchangeable intermediate layers have respective first channels toenable flow of a coolant therein, and have respective second channels orrespective at least one adapted second channel to concentrate thecoolant or the flow of the coolant within the cold plate to correspondto the heat generating feature.

In at least one embodiment, method 500 includes a further step 512 forassociating the cold plate with the at least one computing component. Asub-step may include associating an inlet coolant line to an inlet ofthe first section and an outlet coolant line to an outlet of the firstsection. When the coolant flow is initiated, coolant will flow throughthe inlet cooling line and the inlet of the first section, to the firstchannels and the second channels or at least one adapted second channelto concentrate the flow or the coolant therein.

In at least one embodiment, when during operation it is determined tochange the at least one computing device by replacing it with a secondcomputing component that has a second heat generating feature, a furtherstep of the method 500 or a sub-step of step 506 foresees such a change.The sub-step either preempts or performs a new determining step for asecond area within the cold plate associated with the second heatgenerating feature. In at least one embodiment, the second individualintermediate layer may be pre-qualified for the second computing devicebecause it has the second channels or at least one adapted secondchannel differently located than the first individual intermediatelayer. This allows the second individual intermediate layer toconcentrate the coolant or the flow of the coolant to the second areawithin the cold plate.

FIG. 5B is a process flow of steps available for a method 550 ofmanufacturing the configurable cold plate of FIGS. 2A-4, according to atleast one embodiment. Step 552 provides a first section having at leastone inlet and at least one outlet to couple to fluid adapters of acooling loop. Step 554 provides a second section to hermetically andremovably seal with the first section. In at least one embodiment, steps552, 554 may be performed by a forming machine, by a forging machine, bya casting machine, by a 3-dimensional printer, or a computerizednumerical control (CNC) machine.

Step 556 is a machining step for machining one or more intermediatelayers, which are too be removably located within the second section andthe first section. In at least one embodiment, steps 552, 554 may beperformed beforehand, but step 556 may be performed on demand based inpart on the computing device to be cooled by the cold plate. In at leastone embodiment, step 558 is performed to determine if there arelocations in the cold plate requiring concentration of a coolant or aflow of the coolant. This may be performed by inspecting therequirements of the computing device to be cooled.

When there are locations requiring the concentration of the coolant orits flow, step 560 is performed. In at least one embodiment, using step560, the individual intermediate layers of the one or more intermediatelayers are enabled (such as by machining) to have respective firstchannels to enable flow of a coolant therein, and to have respectivesecond channels or respective at least one adapted second channel toconcentrate the coolant or the flow of the coolant within the respectivesecond channels or the respective at least one adapted second channel.As these benefits are tied to the requirements of the associatedcomputing device, this step may be performed on-demand at the datacenteror in an infrastructure location of the datacenter capable of hosting amachining machines among the above referenced machines with respect tosteps 552, 554. In at least one embodiment, the intermediate layer ispartly machined to fit within the second section and be associated withthe fluid adapters of the first section. However, the channels may bemachined later, such as on-demand.

In at least one embodiment, a sub-step of steps 552, 554 may be toprovide one or more gaskets to enable the hermetic and removable sealbetween the first section and the second section. In at least oneembodiment, a further sub-step of steps 552, 554 provides one or morelatch clips to enable the hermetic and removable seal between the firstsection and the second section. In at least one embodiment, with respectto step 560, when a sub-step determines a cooling requirement of atleast one computing component, at least in part the heat generatingfeature of the at least one computing component, a further sub-step isperformed for drilling first channels in the one or more intermediatelayers to enable flow of the coolant therein; and for drilling secondchannels or machining at least one adapted second channel to concentratethe coolant or the flow of the coolant within the second channels or theat least one adapted second channel according to the location of thecooling requirement of the at least one computing component.

In at least one embodiment, with respect to step 560, when a sub-stepdetermines a cooling requirement of at least one computing component, atleast in part the heat generating feature of the at least one computingcomponent, a further sub-step is performed for printing or growing theone or more intermediate layers to include first channels and to includesecond channels or at least one adapted second channel according to thelocation of the cooling requirement of the at least one computingcomponent. Finally, the bottom section of the cold plate is cleaned andprepared for association with the at least one computing device in step562.

Datacenter

FIG. 6 illustrates an example datacenter 600, in which at least oneembodiment from FIGS. 2A-5B may be used. In at least one embodiment,datacenter 600 includes a datacenter infrastructure layer 610, aframework layer 620, a software layer 630, and an application layer 640.In at least one embodiment, such as described in respect to FIGS. 2A-5B,features in the components associated with a configurable cold plate fora datacenter liquid cooling system may be performed inside or incollaboration with the example datacenter 600. In at least oneembodiment, the infrastructure layer 610, the framework layer 620, thesoftware layer 630, and the application layer 640 may be partly or fullyprovided via computing components on server trays located in racks 210of the datacenter 200. This enables cooling systems of the presentdisclosure to direct cooling to certain ones of the computing componentsin an efficient and effective manner. Further, aspects of thedatacenter, including the datacenter infrastructure layer 610, theframework layer 620, the software layer 630, and the application layer640 may be used to support selection or design of the intermediatelayers for a configurable cold plate as herein discussed with at leastreference to FIGS. 2A-5B above. As such, the discussion in reference toFIG. 6 may be understood to apply to the hardware and software featuresrequired to enable or support a configurable cold plate for a datacenterliquid cooling system for the datacenter of FIGS. 2A-5B, for instance.

In at least one embodiment, as in FIG. 6, datacenter infrastructurelayer 610 may include a resource orchestrator 612, grouped computingresources 614, and node computing resources (“node C.R.s”)616(1)-616(N), where “N” represents any whole, positive integer. In atleast one embodiment, node C.R.s 616(1)-616(N) may include, but are notlimited to, any number of central processing units (“CPUs”) or otherprocessors (including accelerators, field programmable gate arrays(FPGAs), graphics processors, etc.), memory devices (such as dynamicread-only memory), storage devices (such as solid state or disk drives),network input/output (“NW I/O”) devices, network switches, virtualmachines (“VMs”), power modules, and cooling modules, etc. In at leastone embodiment, one or more node C.R.s from among node C.R.s616(1)-616(N) may be a server having one or more of above-mentionedcomputing resources.

In at least one embodiment, grouped computing resources 614 may includeseparate groupings of node C.R.s housed within one or more racks (notshown), or many racks housed in datacenters at various geographicallocations (also not shown). Separate groupings of node C.R.s withingrouped computing resources 614 may include grouped compute, network,memory or storage resources that may be configured or allocated tosupport one or more workloads. In at least one embodiment, several nodeC.R.s including CPUs or processors may grouped within one or more racksto provide compute resources to support one or more workloads. In atleast one embodiment, one or more racks may also include any number ofpower modules, cooling modules, and network switches, in anycombination.

In at least one embodiment, resource orchestrator 612 may configure orotherwise control one or more node C.R.s 616(1)-616(N) and/or groupedcomputing resources 614. In at least one embodiment, resourceorchestrator 612 may include a software design infrastructure (“SDI”)management entity for datacenter 600. In at least one embodiment,resource orchestrator may include hardware, software or some combinationthereof.

In at least one embodiment, as shown in FIG. 6, framework layer 620includes a job scheduler 622, a configuration manager 624, a resourcemanager 626 and a distributed file system 628. In at least oneembodiment, framework layer 620 may include a framework to supportsoftware 632 of software layer 630 and/or one or more application(s) 642of application layer 640. In at least one embodiment, software 632 orapplication(s) 642 may respectively include web-based service softwareor applications, such as those provided by Amazon Web Services, GoogleCloud and Microsoft Azure. In at least one embodiment, framework layer620 may be, but is not limited to, a type of free and open-sourcesoftware web application framework such as Apache Spark™ (hereinafter“Spark”) that may utilize distributed file system 628 for large-scaledata processing (such as “big data”). In at least one embodiment, jobscheduler 622 may include a Spark driver to facilitate scheduling ofworkloads supported by various layers of datacenter 600. In at least oneembodiment, configuration manager 624 may be capable of configuringdifferent layers such as software layer 630 and framework layer 620including Spark and distributed file system 628 for supportinglarge-scale data processing. In at least one embodiment, resourcemanager 626 may be capable of managing clustered or grouped computingresources mapped to or allocated for support of distributed file system628 and job scheduler 622. In at least one embodiment, clustered orgrouped computing resources may include grouped computing resource 614at datacenter infrastructure layer 610. In at least one embodiment,resource manager 626 may coordinate with resource orchestrator 612 tomanage these mapped or allocated computing resources.

In at least one embodiment, software 632 included in software layer 630may include software used by at least portions of node C.R.s616(1)-616(N), grouped computing resources 614, and/or distributed filesystem 628 of framework layer 620. One or more types of software mayinclude, but are not limited to, Internet web page search software,e-mail virus scan software, database software, and streaming videocontent software.

In at least one embodiment, application(s) 642 included in applicationlayer 640 may include one or more types of applications used by at leastportions of node C.R.s 616(1)-616(N), grouped computing resources 614,and/or distributed file system 628 of framework layer 620. One or moretypes of applications may include, but are not limited to, any number ofa genomics application, a cognitive compute, and a machine learningapplication, including training or inferencing software, machinelearning framework software (such as PyTorch, TensorFlow, Caffe, etc.)or other machine learning applications used in conjunction with one ormore embodiments.

In at least one embodiment, any of configuration manager 624, resourcemanager 626, and resource orchestrator 612 may implement any number andtype of self-modifying actions based on any amount and type of dataacquired in any technically feasible fashion. In at least oneembodiment, self-modifying actions may relieve a datacenter operator ofdatacenter 600 from making possibly bad configuration decisions andpossibly avoiding underutilized and/or poor performing portions of adatacenter.

In at least one embodiment, datacenter 600 may include tools, services,software or other resources to train one or more machine learning modelsor predict or infer information using one or more machine learningmodels according to one or more embodiments described herein. In atleast one embodiment, in at least one embodiment, a machine learningmodel may be trained by calculating weight parameters according to aneural network architecture using software and computing resourcesdescribed above with respect to datacenter 600. In at least oneembodiment, trained machine learning models corresponding to one or moreneural networks may be used to infer or predict information usingresources described above with respect to datacenter 600 by using weightparameters calculated through one or more training techniques describedherein. Deep learning may be advanced using any appropriate learningnetwork and the computing capabilities of the datacenter 600. As such, adeep neural network (DNN), a recurrent neural network (RNN) or aconvolutional neural network (CNN) may be supported eithersimultaneously or concurrently using the hardware in the datacenter.Once a network is trained and successfully evaluated to recognize datawithin a subset or a slice, for instance, the trained network canprovide similar representative data for using with the collected data.

In at least one embodiment, datacenter 600 may use CPUs,application-specific integrated circuits (ASICs), GPUs, FPGAs, or otherhardware to perform training and/or inferencing using above-describedresources. Moreover, one or more software and/or hardware resourcesdescribed above may be configured as a service to allow users to trainor performing inferencing of information, such as pressure, flow rates,temperature, and location information, or other artificial intelligenceservices.

Inference and Training Logic

Inference and/or training logic 615 may be used to perform inferencingand/or training operations associated with one or more embodiments. Inat least one embodiment, inference and/or training logic 615 may be usedin system FIG. 6 for inferencing or predicting operations based, atleast in part, on weight parameters calculated using neural networktraining operations, neural network functions and/or architectures, orneural network use cases described herein. In at least one embodiment,inference and/or training logic 615 may include, without limitation,hardware logic in which computational resources are dedicated orotherwise exclusively used in conjunction with weight values or otherinformation corresponding to one or more layers of neurons within aneural network. In at least one embodiment, inference and/or traininglogic 615 may be used in conjunction with an application-specificintegrated circuit (ASIC), such as Tensorflow® Processing Unit fromGoogle, an inference processing unit (IPU) from Graphcore™, or aNervana® (such as “Lake Crest”) processor from Intel Corp.

In at least one embodiment, inference and/or training logic 615 may beused in conjunction with central processing unit (CPU) hardware,graphics processing unit (GPU) hardware or other hardware, such as fieldprogrammable gate arrays (FPGAs). In at least one embodiment, inferenceand/or training logic 615 includes, without limitation, code and/or datastorage modules which may be used to store code (such as graph code),weight values and/or other information, including bias values, gradientinformation, momentum values, and/or other parameter or hyperparameterinformation. In at least one embodiment, each of the code and/or datastorage modules is associated with a dedicated computational resource.In at least one embodiment, the dedicated computational resourceincludes computational hardware that further include one or more ALUsthat perform mathematical functions, such as linear algebraic functions,only on information stored in code and/or data storage modules, andresults from which are stored in an activation storage module of theinference and/or training logic 615.

Other variations are within spirit of present disclosure. Thus, whiledisclosed techniques are susceptible to various modifications andalternative constructions, certain illustrated embodiments thereof areshown in drawings and have been described above in detail. It should beunderstood, however, that there is no intention to limit disclosure tospecific form or forms disclosed, but on contrary, intention is to coverall modifications, alternative constructions, and equivalents fallingwithin spirit and scope of disclosure, as defined in appended claims.

Use of terms “a” and “an” and “the” and similar referents in context ofdescribing disclosed embodiments (especially in context of followingclaims) are to be construed to cover both singular and plural, unlessotherwise indicated herein or clearly contradicted by context, and notas a definition of a term. Terms “including,” “having,” “including,” and“containing” are to be construed as open-ended terms (meaning“including, but not limited to,”) unless otherwise noted. Term“connected,” when unmodified and referring to physical connections, isto be construed as partly or wholly contained within, attached to, orjoined together, even if there is something intervening. Recitation ofranges of values herein are merely intended to serve as a shorthandmethod of referring individually to each separate value falling withinrange, unless otherwise indicated herein and each separate value isincorporated into specification as if it were individually recitedherein. Use of a set (such as a set of items) or subset, unlessotherwise noted or contradicted by context, is to be construed as anonempty collection including one or more members. Further, unlessotherwise noted or contradicted by context, a subset of a correspondingset does not necessarily denote a proper subset of corresponding set,but subset and corresponding set may be equal.

Conjunctive language, such as phrases of form “at least one of A, B, andC,” or “at least one of A, B and C,” unless specifically statedotherwise or otherwise clearly contradicted by context, is otherwiseunderstood with context as used in general to present that an item,term, etc., may be either A or B or C, or any nonempty subset of set ofA and B and C. For instance, in illustrative example of a set havingthree members, conjunctive phrases “at least one of A, B, and C” and “atleast one of A, B and C” refer to any of following sets: {A}, {B}, {C},{A, B}, {A, C}, {B, C}, {A, B, C}. Thus, such conjunctive language maynot be intended to imply that certain embodiments require at least oneof A, at least one of B, and at least one of C each to be present. Inaddition, unless otherwise noted or contradicted by context, a pluralityindicates a state of being plural (such as a plurality of itemsindicates multiple items). A plurality is at least two items, but can bemore when so indicated either explicitly or by context. Further, unlessstated otherwise or otherwise clear from context, based on means basedat least in part on and not based solely on.

Operations of processes described herein can be performed in anysuitable order unless otherwise indicated herein or otherwise clearlycontradicted by context. In at least one embodiment, a process such asthose processes described herein (or variations and/or combinationsthereof) is performed under control of one or more computer systemsconfigured with executable instructions and is implemented as code (suchas executable instructions, one or more computer programs or one or moreapplications) executing collectively on one or more processors, byhardware or combinations thereof. In at least one embodiment, code isstored on a computer-readable storage medium, for example, in form of acomputer program including a plurality of instructions executable by oneor more processors. In at least one embodiment, a computer-readablestorage medium is a non-transitory computer-readable storage medium thatexcludes transitory signals (such as a propagating transient electric orelectromagnetic transmission) but includes non-transitory data storagecircuitry (such as buffers, cache, and queues) within transceivers oftransitory signals. In at least one embodiment, code (such as executablecode or source code) is stored on a set of one or more non-transitorycomputer-readable storage media having stored thereon executableinstructions (or other memory to store executable instructions) that,when executed (in at least one embodiment, as a result of beingexecuted) by one or more processors of a computer system, cause computersystem to perform operations described herein. A set of non-transitorycomputer-readable storage media, in at least one embodiment, includesmultiple non-transitory computer-readable storage media and one or moreof individual non-transitory storage media of multiple non-transitorycomputer-readable storage media lack all of code while multiplenon-transitory computer-readable storage media collectively store all ofcode. In at least one embodiment, executable instructions are executedsuch that different instructions are executed by differentprocessors—for example, a non-transitory computer-readable storagemedium store instructions and a main central processing unit (“CPU”)executes some of instructions while a graphics processing unit (“GPU”)executes other instructions. In at least one embodiment, differentcomponents of a computer system have separate processors and differentprocessors execute different subsets of instructions.

Accordingly, in at least one embodiment, computer systems are configuredto implement one or more services that singly or collectively performoperations of processes described herein and such computer systems areconfigured with applicable hardware and/or software that enableperformance of operations. Further, a computer system that implements atleast one embodiment of present disclosure is a single device and, inanother embodiment, is a distributed computer system including multipledevices that operate differently such that distributed computer systemperforms operations described herein and such that a single device doesnot perform all operations.

Use of any and all examples, or exemplary language (such as “such as”)provided herein, is intended merely to better illuminate embodiments ofdisclosure and does not pose a limitation on scope of disclosure unlessotherwise claimed. No language in specification should be construed asindicating any non-claimed element as essential to practice ofdisclosure.

All references, including publications, patent applications, andpatents, cited herein are hereby incorporated by reference to sameextent as if each reference were individually and specifically indicatedto be incorporated by reference and were set forth in its entiretyherein.

In description and claims, terms “coupled” and “connected,” along withtheir derivatives, may be used. It should be understood that these termsmay be not intended as synonyms for each other. Rather, in particularexamples, “connected” or “coupled” may be used to indicate that two ormore elements are in direct or indirect physical or electrical contactwith each other. “Coupled” may also mean that two or more elements arenot in direct contact with each other, but yet still co-operate orinteract with each other.

Unless specifically stated otherwise, it may be appreciated thatthroughout specification, references to processing, computing,calculating, determining, or the like, refer to action and/or processesof a computer or computing system, or similar electronic computingdevice, that manipulate and/or transform data represented as physical,such as electronic, quantities within computing system's registersand/or memories into other data similarly represented as physicalquantities within computing system's memories, registers or other suchinformation storage, transmission or display devices.

In a similar manner, a processor may refer to any device or portion of adevice that processes electronic data from registers and/or memory andtransform that electronic data into other electronic data that may bestored in registers and/or memory. As non-limiting examples, “processor”may be a CPU or a GPU. A “computing platform” may include one or moreprocessors. As used herein, “software” processes may include, forexample, software and/or hardware entities that perform work over time,such as tasks, threads, and intelligent agents. Also, each process mayrefer to multiple processes, for carrying out instructions in sequenceor in parallel, continuously or intermittently. Terms “system” and“method” are used herein interchangeably insofar as system may embodyone or more methods and methods may be considered a system.

In present document, references may be made to obtaining, acquiring,receiving, or inputting analog or digital data into a subsystem,computer system, or computer-implemented machine. Obtaining, acquiring,receiving, or inputting analog and digital data can be accomplished in avariety of ways such as by receiving data as a parameter of a functioncall or a call to an application programming interface. In someimplementations, process of obtaining, acquiring, receiving, orinputting analog or digital data can be accomplished by transferringdata via a serial or parallel interface. In another implementation,process of obtaining, acquiring, receiving, or inputting analog ordigital data can be accomplished by transferring data via a computernetwork from providing entity to acquiring entity. References may alsobe made to providing, outputting, transmitting, sending, or presentinganalog or digital data. In various examples, process of providing,outputting, transmitting, sending, or presenting analog or digital datacan be accomplished by transferring data as an input or output parameterof a function call, a parameter of an application programming interfaceor interprocess communication mechanism.

Although discussion above sets forth example implementations ofdescribed techniques, other architectures may be used to implementdescribed functionality, and are intended to be within scope of thisdisclosure. Furthermore, although specific distributions ofresponsibilities are defined above for purposes of discussion, variousfunctions and responsibilities might be distributed and divided indifferent ways, depending on circumstances.

Furthermore, although subject matter has been described in languagespecific to structural features and/or methodological acts, it is to beunderstood that subject matter claimed in appended claims is notnecessarily limited to specific features or acts described. Rather,specific features and acts are disclosed as exemplary forms ofimplementing the claims.

What is claimed is:
 1. A cold plate for a datacenter cooling system,comprising: an intermediate layer to be changeable within sections ofthe cold plate, the intermediate layer to comprise channels toconcentrate a coolant or a flow of the coolant to at least one areawithin the cold plate.
 2. The cold plate of claim 1, further comprising:one or more gaskets associated with the sections of the cold plate toenable a hermetic seal once the sections are removably associated witheach other.
 3. The cold plate of claim 1, further comprising: fluidadapters to extend from the cold plate to enable receipt and egress ofthe coolant between the cold plate and at least one cooling manifold. 4.The cold plate of claim 1, further comprising: a second intermediatelayer comprising second channels to replace the intermediate layer basedin part on cooling required in a second area that is different from theat least one area within the cold plate.
 5. The cold plate of claim 4,wherein the each of the at least one area and the second area correspondto different component locations of one or more computing devices. 6.The cold plate of claim 1, further comprising: a first plurality ofslots to traverse a length of the channels, the first plurality of slotsto have first surface areas to concentrate the coolant or the flow ofthe coolant to the at least one area within the cold plate.
 7. The coldplate of claim 6, wherein individual ones of the first plurality ofslots of the intermediate layer comprise a diameter, an angle, or awidth to contribute to the first surface areas relative to a secondplurality of slots of a second intermediate layer comprising secondsurface areas and that is changeable with the intermediate layer toconcentrate the coolant or the flow of the coolant to the at least onesecond area within the cold plate.
 8. The cold plate of claim 1, furthercomprising: one or more latch clips to enable a hermetic and removableseal between the sections of the cold plate.
 9. The cold plate of claim1, further comprising: one or more first inlets and one or more firstoutlets in the intermediate layer to be associated with one or moresecond inlets and one or more second outlets of at least one of thesections prior to associated together of the sections of the cold plate.10. The cold plate of claim 1, wherein the channels comprise firstchannels and second channels, the second channels differentlydimensioned or patterned relative to the first channels to enable theconcentration of the coolant or the flow of the coolant to the at leastone area within the cold plate.
 11. A method for a cold plate comprisinga plurality of intermediate layers that are changeable within sectionsof the cold plate, the method comprising: determining a heat generatingfeature to be associated with the cold plate; and providing anintermediate layer of the plurality of intermediate layers for thesections of the cold plate to concentrate a coolant or a flow of thecoolant to at least one area within the cold plate that corresponds tothe heat generating feature.
 12. The method of claim 11, furthercomprising: enabling a hermetic seal once the sections are removablyassociated with each other using one or more gaskets associated with thesections of the cold plate.
 13. The method of claim 11, furthercomprising: enabling fluid adapters to extend from the cold plate toenable receipt and egress of the coolant between the cold plate and atleast one cooling manifold.
 14. The method of claim 11, furthercomprising: replacing the intermediate layer with a second intermediatelayer comprising second channels based at least in part on coolingrequirement in a second area that is different from the at least onearea within the cold plate.
 15. The method of claim 14, wherein each ofthe at least one area and the second area correspond to differentcomponent locations of one or more computing devices.
 16. The method ofclaim 11, further comprising: concentrating the coolant or the flow ofthe coolant to the at least one area within the cold plate using a firstplurality of slots that traverse a length of the channels, the firstplurality of slots comprising first surface areas to be exposed to thecoolant.
 17. The method of claim 16, wherein individual ones of thefirst plurality of slots of the intermediate layer comprise a diameter,an angle, or a width to contribute to the first surface areas relativeto a second plurality of slots of a second intermediate layer comprisingsecond surface areas and that is changeable with the intermediate layerto concentrate the coolant or the flow of the coolant to the at leastone second area within the cold plate.
 18. The method of claim 11,further comprising: enabling a hermetic and removable seal between thesections of the cold plate using one or more latch clips.
 19. The methodof claim 11, further comprising: associating one or more first inletsand one or more first outlets in the intermediate layer with one or moresecond inlets and one or more second outlets of at least one of thesections prior to associating together the sections of the cold plate.20. The method of claim 11, wherein the channels comprise first channelsand second channels, the second channels differently dimensioned orpatterned relative to the first channels to enable the concentration ofthe coolant or the flow of the coolant to the at least one area withinthe cold plate.